Our client is a global information and communications technology (ICT) solutions provider that has been committed to developing innovative technologies and delivering customised solutions to customers in more than 170 countries and regions for over 30 years. They are currently seeking a talented 3DIC Thermal and Mechanical Modelling Engineer to join their team in the Benelux region.
Role Description
As the 3DIC Thermal and Mechanical Modelling Engineer, you will be responsible for conducting thermal and stress modelling and simulation in 3DIC design, including but not limited to thermal conduction, thermal expansion, mechanical stress, thermo-mechanical coupling, electro-thermal coupling, and electromagnetic coupling. You will utilize numerical simulation methods to optimize designs and resolve potential thermal management issues.
Must Have Skills
- Strong Foundation in Mathematics, Physics, and Thermodynamics – Demonstrated expertise in heat conduction, stress analysis, and materials science principles.
- Thermal and Stress Modelling Methods – Proficiency in numerical simulation techniques such as finite element analysis (FEA) for thermal and stress modelling.
- Simulation Tools Expertise – Proficient in using commercial simulation tools like ANSYS, COMSOL, Cadence, or similar software for thermal and stress analysis.
- Semiconductor 3DIC Design Experience – Relevant experience in understanding and addressing thermal stress issues in semiconductor packaging and multilayer structures.
- Programming Skills – Familiarity with programming languages like Python and C++, with the ability to independently develop simulation scripts and tools.
Nice to Have Skills
- Multiphysics Analysis – Ability to perform coupled analysis, including thermal conduction, thermal expansion, mechanical stress, thermo-mechanical coupling, electro-thermal coupling, and electromagnetic coupling.
- Thermal Simulation Workflow Optimisation – Experience in leading the optimisation and iteration of in-house thermal simulation tools to improve accuracy and efficiency.
- Cross-Functional Collaboration – Demonstrated ability to work closely with cross-functional teams, providing technical support in thermal and stress modelling to ensure successful implementation of design solutions.
- Continuous Improvement – Proactive in improving modelling methodologies and simulation workflows to enhance overall R&D efficiency.
- Semiconductor Packaging Experience – Prior work experience in semiconductor packaging or related fields is preferred.
Job Ref: BBBH26035
Next Steps
If you possess the required skills and experience for this exciting 3DIC Thermal and Mechanical Modelling Engineer role, we encourage you to submit your CV today. Our client is eager to connect with talented professionals who can contribute to their innovative work in the ICT industry.
Interested in this Role? Submit your CV today!
OR
Perhaps this role didn’t fully fit your criteria, not to worry – we likely have similar opportunities advertised on our website – visit: www.allenrec.com
Please don’t hesitate to contact any of our team with any questions you may have on Email: [email protected] or Phone: +32 23202897
