Our client, a leading telecom solutions provider, is seeking a talented 3D Integration Program Director to join their dynamic R&D team. This is an exciting opportunity to work at the forefront of innovation in telecom, AI, 5G, and networking, collaborating with global experts to shape the future of technology.
Role Description
As the 3D Integration Program Director, you will be responsible for leading high-impact projects in AI/CPU, networking, and other future-driven areas. You will design and implement a competitive 3D engineering architecture based on cutting-edge application scenarios, decomposing complex engineering structures into actionable plans and driving innovative research to turn technical ideas into commercial breakthroughs.
Must Have Skills
- PhD in Engineering, Materials Science, or a related field
- Over 10 years of experience in 3D integration, semiconductor manufacturing, or advanced materials
- Deep knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stacking
- Strong communication skills and a collaborative mindset
- Excellent analytical abilities and experience in leading complex projects
Nice to Have Skills
- Experience in the telecom industry or related sectors
- Familiarity with 5G and AI technologies
- Proven track record of successful research and development projects
Job Ref: BBBH26007
Next Steps
If you’re a PhD-level expert in 3D integration and ready to make an impact on the future of tech, we encourage you to apply for this exciting opportunity with our client. Submit your CV today, and one of our consultants will be in touch to discuss the next steps.
Interested in this Role? Submit your CV today!
OR
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Please don’t hesitate to contact any of our team with any questions you may have on Email: [email protected]
